ENGEL packaging at swop 2019 Shanghai

Impressive decorations and efficiency combined –

Schwertberg/Austria – October 2019
A large packaging market in search of innovative packaging solutions, this is the swop 2019 trade fair from November 25th to 28th in Shanghai, China. The quality and design requirements in China and Asia today are very different from those of a just few years ago. Both the packaging and the manufacturing processes need to achieve an impressive level of decoration, functionality and efficiency. With the all-electric e-mac injection moulding machine, ENGEL is showing that a combination of visual appeal, functionality and efficiency is possible.

WHAT:   Shanghai World of Packaging SWOP 2019

WHERE: Shanghai New International Expo Center

WHEN:   November 25th – 28th 2019

STAND / BOOTH NO:  ENGEL in Hall N1, Stand E41


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Visit the swop 2019 website here

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